US 12,424,459 B2
Substrate processing apparatus and substrate processing method
Hiroki Sakurai, Kumamoto (JP); Yenrui Hsu, Kumamoto (JP); Shoki Mizuguchi, Kumamoto (JP); Nobuhiro Ogata, Kumamoto (JP); Shinichi Umeno, Kumamoto (JP); Kazuya Goda, Kumamoto (JP); Minsung Kim, Kumamoto (JP); and Hiroyuki Higashi, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED., Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jun. 28, 2023, as Appl. No. 18/215,184.
Claims priority of application No. 2022-112964 (JP), filed on Jul. 14, 2022.
Prior Publication US 2024/0021445 A1, Jan. 18, 2024
Int. Cl. H01L 21/67 (2006.01); B05B 7/04 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67051 (2013.01) [B05B 7/0416 (2013.01); H01L 21/02057 (2013.01); H01L 21/6708 (2013.01); H01L 21/67248 (2013.01); H01L 21/68764 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a substrate holding unit that holds a substrate to be rotatable;
a fluid supplying unit that supplies fluid including pressurized vapor or mist of deionized water;
a processing-liquid supplying unit that supplies processing liquid including at least sulfuric acid;
a nozzle that is connected to the fluid supplying unit and the processing-liquid supplying unit to discharge mixed fluid of the fluid and the processing liquid toward the substrate;
a fluid amount adjusting unit that adjusts a flow volume of the fluid that is flowing through the fluid supplying unit; and
a controller that controls the fluid amount adjusting unit to adjust a ratio of the fluid to the processing liquid, wherein
the nozzle includes a long nozzle that extends along a horizontal direction,
the substrate processing apparatus further comprises a second nozzle in addition to the long nozzle, and
the controller is further configured to:
prior to a mixed fluid supplying process for supplying the mixed fluid to the substrate from the nozzle, execute a liquid-film forming process for supplying deionized water to the substrate from the second nozzle to form a liquid film of the deionized water on a surface of the substrate, and then supply the vapor or the mist from the nozzle to the substrate on which the liquid film is formed to execute a heating process for heating the nozzle.