US 12,424,452 B2
Deflectable platens and associated methods
Ming Yin, Gloucester, MA (US); and Dawei Sun, Nashua, NH (US)
Assigned to APPLIED Materials, Inc.
Filed by APPLIED Materials, Inc., Santa Clara, CA (US)
Filed on Mar. 1, 2022, as Appl. No. 17/683,479.
Application 17/683,479 is a division of application No. 16/657,020, filed on Oct. 18, 2019, granted, now 11,302,536.
Prior Publication US 2022/0189784 A1, Jun. 16, 2022
Int. Cl. H01L 21/324 (2006.01); H01L 21/20 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/324 (2013.01) [H01L 21/2007 (2013.01); H01L 21/6835 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method of deflecting a platen comprising:
providing a first layer formed of a material having a first coefficient of thermal expansion (CTE);
providing a second layer formed of a material having a second CTE bonded to, and in directed contact with, the first layer, the second layer including a plurality of electrodes embedded therein for facilitating electrostatic clamping of wafers to the second layer, wherein the second CTE is different than the first CTE; and
activating a heat trace disposed between the first layer and the second layer to heat the first layer and the second layer to a temperature in a range of 200 degrees Celsius to 600 degrees Celsius, wherein the heat trace is disposed entirely between, and is in direct contact with, the first layer and the second layer.