US 12,424,424 B2
Plasma monitoring system, plasma monitoring method, and monitoring device
Satoru Teruuchi, Miyagi (JP); Jun Hirose, Miyagi (JP); Kazuya Nagaseki, Miyagi (JP); and Shinji Himori, Miyagi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Nov. 20, 2023, as Appl. No. 18/515,220.
Application 18/515,220 is a continuation of application No. PCT/JP2022/020855, filed on May 19, 2022.
Claims priority of application No. 2021-088516 (JP), filed on May 26, 2021.
Prior Publication US 2024/0096608 A1, Mar. 21, 2024
Int. Cl. H01J 37/32 (2006.01); G01N 21/68 (2006.01); H01L 21/67 (2006.01)
CPC H01J 37/32935 (2013.01) [G01N 21/68 (2013.01); H01J 2237/2445 (2013.01); H01J 2237/24585 (2013.01); H01L 21/67253 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A plasma monitoring system for measuring a light emission intensity of a plasma generated in a plasma processing apparatus, the system comprising:
a monitoring device to be placed on a stage in the plasma processing apparatus, the monitoring device including a plate-shaped base substrate, and a plurality of spectroscopes having optical axes facing upward on the base substrate, and being disposed apart from each other to acquire light emission intensities of the plasma; and
a control device for acquiring light emission intensity distribution data of the plasma in the plasma processing apparatus based on the light emission intensity acquired by each of the plurality of spectroscopes.