US 12,424,416 B2
Substrate processing apparatus and parameter acquisition method
Kazuhito Yamada, Miyagi (JP); and Hiroki Endo, Miyagi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on May 20, 2021, as Appl. No. 17/325,594.
Claims priority of application No. 2020-088967 (JP), filed on May 21, 2020.
Prior Publication US 2021/0366692 A1, Nov. 25, 2021
Int. Cl. H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H05B 1/02 (2006.01); H05B 3/28 (2006.01)
CPC H01J 37/32522 (2013.01) [H01L 21/67248 (2013.01); H01L 21/67253 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H05B 1/0233 (2013.01); H05B 3/283 (2013.01); H01J 2237/334 (2013.01); H05B 2213/07 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a heater resistor;
a digital filter configured to filter at least one of a detection voltage, which is a digital voltage value detected as a voltage applied to the heater resistor, or a detection current, which is detected as a voltage calculated from the heater resistor and a current flowing in the heater resistor and converted into a digital voltage value; and
a controller configured to control a temperature of the heater resistor with the detection voltage and the detection current, at least one of the detection voltage or the detection current being filtered by the digital filter,
wherein the heater resistor is heated with a power supplied from an AC power supply, and
the controller calculates a resistance value of the heater resistor based on an effective value of the detection voltage and an effective value of the detection current.