US 12,424,413 B2
Substrate support with real time force and film stress control
Wendell Glenn Boyd, Jr., Morgan Hill, CA (US); Govinda Raj, Santa Clara, CA (US); and Matthew James Busche, Santa Clara, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jan. 18, 2024, as Appl. No. 18/416,580.
Application 18/302,854 is a division of application No. 17/095,577, filed on Nov. 11, 2020, granted, now 11,676,802, issued on Jun. 13, 2023.
Application 18/416,580 is a continuation of application No. 18/302,854, filed on Apr. 19, 2023, granted, now 11,915,913.
Application 17/095,577 is a continuation of application No. 14/852,485, filed on Sep. 11, 2015, granted, now 10,879,046, issued on Dec. 29, 2020.
Prior Publication US 2024/0258075 A1, Aug. 1, 2024
Int. Cl. H01J 37/32 (2006.01); C23C 16/458 (2006.01); H01L 21/683 (2006.01); G01D 5/26 (2006.01); G01D 11/24 (2006.01); G01L 11/02 (2006.01)
CPC H01J 37/3244 (2013.01) [C23C 16/4586 (2013.01); H01J 37/32009 (2013.01); H01J 37/32697 (2013.01); H01J 37/32715 (2013.01); H01J 37/3299 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); G01D 5/26 (2013.01); G01D 5/266 (2013.01); G01D 5/268 (2013.01); G01D 11/245 (2013.01); G01L 11/025 (2013.01); H01J 2237/334 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A method for processing a substrate disposed on a substrate support, comprising:
chucking the substrate to the substrate support;
monitoring a chucking force on the substrate with a sensor assembly disposed in a backside gas hole of the substrate support, wherein:
the sensor assembly is disposed in the backside gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on a workpiece support surface;
the sensor assembly has passages that permit fluid to pass through the sensor assembly when positioned in the backside gas hole;
the sensor assembly has a sensor housing and a sensor, the sensor housing having a split plate configured to be disposed around at least a portion of the sensor;
the passages include gas passages formed in the split plate; and
flowing a gas through the backside gas hole past the sensor.