US 12,424,384 B2
Multilayer electronic component and method of manufacturing the same
Won Jun Na, Suwon-si (KR); Yun Sung Kang, Suwon-si (KR); Hoe Chul Jung, Suwon-si (KR); Sun Hwa Kim, Suwon-si (KR); and Byeong Gyu Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jun. 14, 2023, as Appl. No. 18/209,619.
Claims priority of application No. 10-2022-0189617 (KR), filed on Dec. 29, 2022; and application No. 10-2023-0031805 (KR), filed on Mar. 10, 2023.
Prior Publication US 2024/0222013 A1, Jul. 4, 2024
Int. Cl. H01G 4/008 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/0085 (2013.01) [H01G 4/30 (2013.01); H01G 4/1227 (2013.01)] 48 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
a body including a plurality of dielectric layers and a plurality of internal electrodes, wherein at least one of the plurality of internal electrodes includes Ni, Sr, and Ru, and an average content of (Sr+Ru)/(Ni+Sr+Ru) is more than 0 wt % and less than 8.40 wt %; and
external electrodes disposed on the body.