US 12,424,018 B2
Method of fabricating electronic device including a sensor module
Shinya Onoue, Hwaseong-si (KR); Dongjin Jeong, Seoul (KR); and Jin Hyun, Hwaseong-si (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Filed by Samsung Display Co., Ltd., Yongin-Si (KR)
Filed on Nov. 21, 2022, as Appl. No. 17/991,162.
Claims priority of application No. 10-2022-0029076 (KR), filed on Mar. 8, 2022.
Prior Publication US 2023/0290175 A1, Sep. 14, 2023
Int. Cl. H10K 59/00 (2023.01); G06V 40/13 (2022.01); H10K 59/65 (2023.01); H10K 71/00 (2023.01)
CPC G06V 40/1306 (2022.01) [H10K 59/65 (2023.02); H10K 71/00 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A method of fabricating an electronic device, comprising:
fabricating a display module including a display panel, a protection film disposed on the display panel, and a cover panel disposed on the protection film, wherein the cover panel has an open portion partially exposing the protection film;
forming a first resin on a first region of the open portion;
forming a second resin on a second region, which is adjacent to the first region;
emitting a first UV ray to the first and second resins;
placing a sensor module on the first resin;
pressing the sensor module such that the first and second resins fill the first and second regions and a first filling layer and a second filling layer in the first region and the second region, respectively, are formed; and
emitting a second UV ray, which has an intensity different from that of the first UV ray, to the second filling layer in the second region to cure the second filling layer.