US 12,423,801 B2
Substrate treating apparatus, substrate treating system, and substrate treating method
Shinji Shimizu, Kyoto (JP)
Assigned to SCREEN Holdings Co., Ltd., (JP)
Filed by SCREEN Holdings Co., Ltd., Kyoto (JP)
Filed on Feb. 17, 2023, as Appl. No. 18/171,135.
Claims priority of application No. 2022-025799 (JP), filed on Feb. 22, 2022.
Prior Publication US 2023/0267603 A1, Aug. 24, 2023
Int. Cl. G06T 7/00 (2017.01); B05B 12/12 (2006.01); B05D 1/00 (2006.01); B08B 3/04 (2006.01)
CPC G06T 7/001 (2013.01) [B05B 12/122 (2013.01); B05D 1/002 (2013.01); B08B 3/04 (2013.01); G06T 2207/30148 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A substrate treating apparatus for performing a predetermined treatment on a substrate, the apparatus comprising:
a recipe memory unit configured to store a recipe, specifying operation details and an execution order of a component that forms the substrate treating apparatus, to perform the predetermined treatment;
an imaging unit provided at a predetermined location and configured to image the component as a real image at work;
a normal image memory unit configured to simulate a condition in advance where the component normally operates in response to the recipe and store in advance a normal image at this time in a view from the location in accordance with three-dimensional design information of the substrate treating apparatus;
an operation controller configured to control the component in response to the recipe to perform the predetermined treatment; and
an abnormality detecting unit configured to detect an abnormality in accordance with a difference between the normal image synchronized with operation of the recipe and the real image at work when the operation controller actually treats the substrate in response to the recipe.