US 12,422,906 B2
Automated thermal property assignment based on surrounding part substrate
Patrick A. Hampton, Round Rock, TX (US); Ernesto Ramirez, Austin, TX (US); and Bo Hom, Round Rock, TX (US)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by Dell Products L.P., Round Rock, TX (US)
Filed on Feb. 25, 2021, as Appl. No. 17/184,637.
Prior Publication US 2022/0269321 A1, Aug. 25, 2022
Int. Cl. G06F 1/20 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01)
CPC G06F 1/203 (2013.01) [H05K 7/20172 (2013.01); H05K 7/20209 (2013.01); H05K 1/181 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A portable information handling system, comprising:
a main housing portion, the main housing portion comprising a first enclosure portion, a second enclosure portion, a motherboard, an electrical path detection component and a thermal characteristic selection system, the electrical path detection component being physically coupled between one of the first enclosure portion and the second enclosure portion and the motherboard, the thermal characteristic selection system determining a material of the one of the first enclosure portion and the second enclosure portion, the thermal characteristic selection system adjusting a thermal design power value based upon a particular configuration of the material, the particular configuration being one of a plurality of material configurations, the thermal design power value corresponding to a particular thermal wattage, the particular thermal wattage being associated with the particular configuration of the material; and,
a lid housing portion, the display chassis portion comprising a display component and a rear display cover portion; and wherein
the thermal characteristic selection system adjusts the thermal design power value based upon a value of a substrate material signal.