US 12,422,823 B2
Workpiece machining device
Shinya Kumazaki, Toyota (JP); and Masashi Ogawa, Toyota (JP)
Assigned to FUJI CORPORATION, Chiryu (JP)
Appl. No. 17/996,979
Filed by FUJI CORPORATION, Chiryu (JP)
PCT Filed May 30, 2020, PCT No. PCT/JP2020/021501
§ 371(c)(1), (2) Date Oct. 24, 2022,
PCT Pub. No. WO2021/245717, PCT Pub. Date Dec. 9, 2021.
Prior Publication US 2023/0176546 A1, Jun. 8, 2023
Int. Cl. G05B 19/4155 (2006.01); B23Q 15/12 (2006.01)
CPC G05B 19/4155 (2013.01) [B23Q 15/12 (2013.01); G05B 2219/33099 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A workpiece machining device for executing machining of a workpiece using a machining tool, comprising:
processing circuitry configured to:
detect a detectable physical amount that is a physical amount relating to the machining of the workpiece and that can be detected at each of detection points that are set at predetermined intervals in a monitoring range for monitoring a state of the detectable physical amount;
store, in a memory, machining data that is actual detection data that is actually detected by the processing circuitry;
form a plurality of groups by dividing the actual detection data in accordance with a number of the detection points that are set in advance in an interval from a monitoring start point to a monitoring end point of the monitoring range;
set an upper limit value and a lower limit value of the monitoring range for each group of the plurality of groups based on the actual detection data belonging to the each group;
determine whether a load detection value that is a detected machining load falls within the range of the upper and lower limit values of the monitoring range; and
in response to determining that the load detection value does not fall within the range of the upper and lower limit values of the monitoring range, stop the machining of the workpiece and issue a warning.