US 12,422,745 B2
Imprint device and imprint method
Yukiko Kondo, Kawasaki (JP); and Satoru Tanaka, Kawasaki (JP)
Assigned to SCIVAX CORPORATION, Kanagawa (JP); and SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Filed by SCIVAX CORPORATION, Kanagawa (JP); and SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Filed on Jun. 24, 2022, as Appl. No. 17/849,575.
Application 17/849,575 is a continuation in part of application No. PCT/JP2020/047648, filed on Dec. 21, 2020.
Claims priority of application No. 2019-234816 (JP), filed on Dec. 25, 2019.
Prior Publication US 2022/0317568 A1, Oct. 6, 2022
Int. Cl. G03F 7/00 (2006.01); B29C 59/02 (2006.01); H01L 21/67 (2006.01)
CPC G03F 7/0002 (2013.01) [B29C 59/02 (2013.01); G03F 7/0015 (2013.01); H01L 21/67144 (2013.01)] 23 Claims
OG exemplary drawing
 
1. An imprinting method of transferring a molding pattern of a mold to an object, the imprinting method comprising:
a depressurizing process of depressurizing by eliminating a gas from between the mold and the object in a pressure adjusting chamber;
a placing process of placing, in the depressurizing process, the mold and a substrate with the object being held between the mold and the substrate, and with either one of the mold and the substrate being placed on the object with a fluidity so as to be substantially floating;
a pressurizing process of pressurizing the mold against the object by positive gas pressure uniformly applied in the pressure adjusting chamber within a range that with either the mold or the substrate placed against a stage, the other of the mold and the substrate is placed on the object so as to be substantially floating on the object with the mold and substrate spaced from one another; and
a fixing process of fixing the object to the molding pattern.