US 12,422,712 B2
Light-emitting substrate and method of manufacturing the same, backlight module and display apparatus
Hai Tang, Beijing (CN); Xiaolin Geng, Beijing (CN); Ming Zhai, Beijing (CN); Liang Gao, Beijing (CN); Bing Zhang, Beijing (CN); and Wei Huang, Beijing (CN)
Assigned to Hefei BOE Ruisheng Technology Co., Ltd., Anhui (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 18/264,451
Filed by Hefei BOE Ruisheng Technology Co., Ltd., Anhui (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed May 31, 2022, PCT No. PCT/CN2022/096209
§ 371(c)(1), (2) Date Aug. 7, 2023,
PCT Pub. No. WO2023/230830, PCT Pub. Date Dec. 7, 2023.
Prior Publication US 2024/0427189 A1, Dec. 26, 2024
Int. Cl. G02F 1/00 (2006.01); G02F 1/1335 (2006.01); G02F 1/13357 (2006.01)
CPC G02F 1/133605 (2013.01) [G02F 1/133611 (2013.01); G02F 1/133612 (2021.01); G02F 1/133514 (2013.01); G02F 1/133603 (2013.01); G02F 1/133606 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A light-emitting substrate, comprising:
a substrate;
a plurality of light-emitting devices and a reflective layer that are disposed on a side of the substrate; and
a plurality of driving chips disposed on a side, the same as the side where the plurality of light-emitting devices are located, of the substrate, wherein
the reflective layer has a plurality of openings, and the plurality of openings include a plurality of first openings; a light-emitting device of the plurality of light-emitting devices is located in a first opening of the plurality of first openings;
a surface of the reflective layer away from the substrate has a plurality of protruding structures;
a driving chip of the plurality of driving chips is electrically connected to at least one light-emitting device of the plurality of light-emitting devices, and the driving chip is configured to drive the at least one light-emitting device to emit light; and
an orthographic projection of at least one driving chip of the plurality of driving chips on the substrate is located within an orthographic projection of the reflective layer on the substrate.