| CPC G02B 6/423 (2013.01) [G02B 6/4228 (2013.01); G02B 6/3873 (2013.01); G02B 6/4234 (2013.01)] | 19 Claims |

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1. A system for edge-coupling of electro-optic chips, comprising:
a first chip including a facet formed at an edge of the first chip, the first chip including a first plurality of optical waveguides exposed at the facet of the first chip; and
a second chip including a facet formed at an edge of the second chip, the second chip including a second plurality of optical waveguides exposed at the facet of the second chip, the second plurality of optical waveguides positioned to align with the first plurality of optical waveguides when the second chip is edge-coupled to the first chip,
wherein the second chip is positioned with the facet of the second chip in contact with the facet of the first chip and with the second plurality of optical waveguides respectively aligned with the first plurality of optical waveguides, such that there is substantially no gap between the facet of the second chip and the facet of the first chip, wherein the facet of the second chip extends a specified distance into the second chip such that a portion of the second chip extends from the facet of the second chip over at least a portion of the first chip, the specified distance defined to achieve vertical alignment of the second plurality of optical waveguides with the first plurality of optical waveguides when the portion of the second chip is positioned in contact with the first chip.
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