| CPC G02B 6/122 (2013.01) [G02B 6/13 (2013.01); G02B 2006/12126 (2013.01)] | 20 Claims |

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1. A photonic integrated circuit (PIC) structure, comprising:
a photonic component, wherein at least a portion of the photonic component is positioned in an active semiconductor layer of a semiconductor substrate;
a passive optical guard composed of a light absorbing material and in proximity to the photonic component, wherein the passive optical guard includes at least a portion positioned in the active semiconductor layer of the semiconductor substrate, and wherein the passive optical guard is entirely below a first metal layer and above a base semiconductor layer of the PIC structure; and
an insulator layer separating the photonic component and the passive optical guard.
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