US 12,422,615 B2
Nested glass packaging architecture for hybrid electrical and optical communication devices
Srinivas V. Pietambaram, Chandler, AZ (US); Brandon C. Marin, Chandler, AZ (US); Debendra Mallik, Chandler, AZ (US); Tarek A. Ibrahim, Mesa, AZ (US); Jeremy Ecton, Gilbert, AZ (US); Omkar G. Karhade, Chandler, AZ (US); Bharat Prasad Penmecha, Phoenix, AZ (US); Xiaoqian Li, Chandler, AZ (US); Nitin A. Deshpande, Chandler, AZ (US); Mitul Modi, Phoenix, AZ (US); and Bai Nie, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 13, 2021, as Appl. No. 17/473,694.
Prior Publication US 2023/0080454 A1, Mar. 16, 2023
Int. Cl. G02B 6/12 (2006.01); H01L 23/48 (2006.01)
CPC G02B 6/12004 (2013.01) [H01L 23/481 (2013.01); G02B 2006/12038 (2013.01); G02B 2006/12102 (2013.01); G02B 2006/12121 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A substrate comprising:
a core of glass;
alternating layers of dielectric and conductive traces on either side of the core, wherein:
the core comprises a waveguide having a first endpoint on a first side of the core, and a second endpoint on a second side of the core, and
the first side is orthogonal to the second side; and
TGVs through the dielectric and the core, wherein the TGVs electrically couple a third side of the substrate with a fourth side of the substrate opposite to the third side.