| CPC G01R 31/66 (2020.01) | 6 Claims |
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1. An electronic device, comprising:
a substrate;
an electronic element disposed on the substrate;
a layer disposed between the substrate and the electronic element;
a plurality of first bonding pads disposed corresponding to the electronic element;
a transistor electrically connected with the electronic element through the plurality of first bonding pads; and
a plurality of second bonding pads separated from the plurality of first bonding pads, wherein in a cross section view, a number of the plurality of first bonding pads is different from a number of the plurality of second bonding pads, and the substrate is disposed between the plurality of first bonding pads and the plurality of second bonding pads,
wherein the transistor is disposed between the plurality of first bonding pads and the layer,
wherein the electronic element and the transistor are at least partially overlapped in a normal direction of the substrate.
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