US 12,422,473 B2
High temperature test device of semiconductor memory module and method for controlling module temperature thereof
Sunhee Kim, Suwon-si (KR); Sun-Gi Lee, Suwon-si (KR); and Soo-In Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Oct. 10, 2023, as Appl. No. 18/378,594.
Claims priority of application No. 10-2023-0056881 (KR), filed on May 2, 2023.
Prior Publication US 2024/0369622 A1, Nov. 7, 2024
Int. Cl. G01R 31/28 (2006.01)
CPC G01R 31/2877 (2013.01) [G01R 31/2875 (2013.01); G01R 31/2889 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A high temperature test device of a memory module comprising:
an airtight housing configured to seal the memory module mounted on a main board;
a heater disposed above the main board inside the airtight housing;
a first fan disposed on an upper portion of the airtight housing above the heater and configured to send heat from the heater to the memory module;
a second fan disposed on the upper portion of the airtight housing and configured to send air inside the airtight housing to the outside of the airtight housing; and
a temperature controller configured to adjust an output ratio of the first fan to the second fan during a mounting test of the memory module to manage a module temperature of the memory module to be maintained within a specified range,
wherein the temperature controller is configured to periodically receive the module temperature from the main board, and adjust the output ratio of the first fan to the second fan based on a deviation between the module temperature and a target temperature.