US 12,422,472 B2
Temperature control device, electronic component handling apparatus, electronic component test apparatus, and DUT temperature control method
Aritomo Kikuchi, Tokyo (JP)
Assigned to ADVANTEST Corporation, Tokyo (JP)
Filed by ADVANTEST Corporation, Tokyo (JP)
Filed on Dec. 30, 2022, as Appl. No. 18/091,814.
Claims priority of application No. 2022-058828 (JP), filed on Mar. 31, 2022.
Prior Publication US 2023/0314500 A1, Oct. 5, 2023
Int. Cl. G01R 31/28 (2006.01)
CPC G01R 31/2877 (2013.01) [G01R 31/2865 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A temperature control device that controls a temperature of a device under test (DUT) in testing the DUT by an electronic component test apparatus, the temperature control device comprising:
a first flow path that has a first connection port configured to be separably connected to an inlet of a device flow path of the DUT, wherein the device flow path is a space between a board of the DUT and a lid that is attached to the board and covers a die mounted on the board, and the inlet is formed in the board or the lid; and
a fluid supply system that is connected to the first flow path and supplies a first fluid for temperature control to the device flow path such that the first fluid passes through the device flow path and directly contacts the die.