US 12,422,471 B2
Multiphase thermal interface component, method of forming the same and electronic device testing apparatus provided with the same
Yu-Wei Chuang, Taoyuan (TW); Xin-Yi Wu, Taoyuan (TW); and Jui-Che Chou, Taoyuan (TW)
Assigned to CHROMA ATE INC., Taoyuan (TW)
Filed by CHROMA ATE INC., Taoyuan (TW)
Filed on Nov. 16, 2023, as Appl. No. 18/511,638.
Claims priority of application No. 111147729 (TW), filed on Dec. 13, 2022.
Prior Publication US 2024/0192268 A1, Jun. 13, 2024
Int. Cl. G01R 31/28 (2006.01); G05D 23/20 (2006.01); H01L 21/66 (2006.01)
CPC G01R 31/2874 (2013.01) [G01R 31/2863 (2013.01); G05D 23/20 (2013.01); H01L 22/12 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method of forming a multiphase thermal interface component, wherein the method comprises following steps:
providing a thermal interface solid element, wherein the thermal interface solid element has a first thermal conductive surface and a second thermal conductive surface, and at least one surface among the first thermal conductive surface and the second thermal conductive surface has at least one accommodation space: the first thermal conductive surface is configured to contact a thermal control device, and the second thermal conductive surface is configured to contact a temperature-controlled component; and
applying a thermal interface fluid material to at least one among on the thermal interface solid element, between the thermal control device and the first thermal conductive surface, and between the second thermal conductive surface and the temperature-controlled component, and filling the thermal interface fluid material in the at least one accommodation space: the thermal interface fluid material under ambient temperature is in liquid, gas, or gel state, or a combination of any two or three thereof.