US 12,422,459 B2
Semiconductor device package with internal magnetic shield for hall sensor
Yi Yan, San Jose, CA (US); Dok Won Lee, Mountain View, CA (US); Hank Ming Sung, Sachse, TX (US); and Kenji Otake, Nagano (JP)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Oct. 31, 2023, as Appl. No. 18/499,086.
Prior Publication US 2025/0138054 A1, May 1, 2025
Int. Cl. G01R 15/20 (2006.01); G01R 19/00 (2006.01); H10N 52/01 (2023.01); H10N 52/80 (2023.01)
CPC G01R 15/202 (2013.01) [G01R 19/0092 (2013.01); H10N 52/01 (2023.02); H10N 52/80 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A method of forming a semiconductor device package, comprising:
forming a package substrate having a board side surface and an opposite top surface, and having a heat slug coupled to the package substrate, the heat slug configured to conduct a current between terminals of the package substrate;
mounting a first magnetic shield to the package substrate, the first magnetic shield comprising a die mount area facing the board side surface, the die mount area exposed from the package substrate and the heat slug;
mounting a semiconductor die having a Hall element on the die mount area, the semiconductor die flip chip mounted and facing away from the board side surface of the package substrate;
mounting a second magnetic shield to the package substrate and the heat slug, the second magnetic shield having a cantilever portion that extends over a portion of the semiconductor die including the Hall element, while bond pads on the semiconductor die remain exposed from the second magnetic shield;
forming electrical connections of wire bonds or ribbon bonds between the bond pads of the semiconductor die and leads on the package substrate; and
covering the electrical connections, the semiconductor die, and portions of the package substrate, the first magnetic shield, and the second magnetic shield with mold compound, while a portion of the heat slug is exposed from the mold compound forming a thermal pad for the semiconductor device package.