US 12,422,409 B2
Ultrasound image apparatus and liquid infiltration prevention method into bonded wafer
Shigeru Ohno, Hitachi (JP); Kazuhiro Noda, Tokyo (JP); Kotaro Kikukawa, Hitachi (JP); and Natsuki Sugaya, Hitachi (JP)
Assigned to Hitachi Power Solutions Co., Ltd., Ibaraki (JP)
Filed by Hitachi Power Solutions Co., Ltd., Ibaraki (JP)
Filed on May 16, 2023, as Appl. No. 18/198,221.
Claims priority of application No. 2022-082383 (JP), filed on May 19, 2022.
Prior Publication US 2023/0375507 A1, Nov. 23, 2023
Int. Cl. G01N 29/06 (2006.01); G01N 29/265 (2006.01)
CPC G01N 29/0654 (2013.01) [G01N 29/265 (2013.01); G01N 2291/2697 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An ultrasound image apparatus that irradiates a bonded wafer in which two or more wafers are bonded with an ultrasonic wave and acquires a reflected wave of the ultrasonic wave to generate an image of a bonded surface between the wafers, the ultrasound image apparatus comprising:
an ultrasonic probe that irradiates the bonded wafer with the ultrasonic wave while moving along a bottom surface on a lower side of the bottom surface of the bonded wafer and acquires a reflected wave of the ultrasonic wave;
a liquid ejection unit that moves together with the ultrasonic probe while continuously ejecting a liquid that propagates the ultrasonic wave toward the bottom surface such that a liquid film in contact with the bottom surface is formed between the liquid ejection unit and the bottom surface of the bonded wafer; and
a gas ejection device that ejects gas,
wherein the gas ejection device includes a gas ejection unit that ejects gas for pushing down the liquid toward an outer peripheral end portion of the bonded wafer so that the liquid ejected from the liquid ejection unit does not infiltrate into the bonded surface from the outer peripheral end portion of the bonded wafer.