US 12,422,400 B2
Lithography production method
Ulrich Bockelmann, Paris (FR); and Kokoura Mensah, Paris (FR)
Assigned to CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, Paris (FR); ECOLE SUPERIEURE DE PHYSIQUE ET DE CHIMIE INDUSTRIELLES DE LA VILLE DE PARIS, Paris (FR); and SORBONNE UNIVERSITE, Paris (FR)
Appl. No. 17/596,991
Filed by CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, Paris (FR); ECOLE SUPERIEURE DE PHYSIQUE ET DE CHIMIE INDUSTRIELLES DE LA VILLE DE PARIS, Paris (FR); and SORBONNE UNIVERSITE, Paris (FR)
PCT Filed Jun. 30, 2020, PCT No. PCT/EP2020/068391
§ 371(c)(1), (2) Date Dec. 22, 2021,
PCT Pub. No. WO2021/001363, PCT Pub. Date Jan. 7, 2021.
Claims priority of application No. 1907342 (FR), filed on Jul. 2, 2019.
Prior Publication US 2022/0244217 A1, Aug. 4, 2022
Int. Cl. G01N 27/414 (2006.01); H01L 21/027 (2006.01)
CPC G01N 27/4145 (2013.01) [H01L 21/0274 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for producing a device, comprising:
providing a conductive layer between a substrate and a protective layer;
depositing a first lithography resin layer above or on the protective layer such that the protective layer is comprised between the conductive layer and the first resin layer;
a first lithography comprising:
a) removing, in at least one removal area of the first lithography, the superimposition of the first resin layer, the protective layer and the conductive layer; and
b) preserving, in at least one preservation area of the first lithography, the superimposition of the first resin layer, the protective layer and the conductive layer; and
depositing, at least on the at least one preservation area of the first lithography, preferably on the at least one removal area and on the at least one preservation area of the first lithography, a second lithography resin layer without removing the first resin layer of the at least one preservation area of the first lithography; and
a second lithography comprising:
a) removing, in at least one removal area of the second lithography, the superimposition of the second resin, the first resin and the protective layer, but not the conductive layer; and
b) preserving, in at least one preservation area of the second lithography, the superimposition of the second resin, the first resin, the protective layer and the conductive layer.