US 12,422,324 B2
Pressure sensor
Tadashi Matsudate, Tokyo (JP); and Manabu Orito, Tokyo (JP)
Assigned to SEMITEC Corporation, Tokyo (JP)
Appl. No. 17/625,776
Filed by SEMITEC Corporation, Tokyo (JP)
PCT Filed Jun. 26, 2020, PCT No. PCT/JP2020/025249
§ 371(c)(1), (2) Date Jan. 10, 2022,
PCT Pub. No. WO2021/010139, PCT Pub. Date Jan. 21, 2021.
Claims priority of application No. 2019-132612 (JP), filed on Jul. 18, 2019.
Prior Publication US 2022/0276110 A1, Sep. 1, 2022
Int. Cl. G01L 19/14 (2006.01); G01L 19/00 (2006.01)
CPC G01L 19/148 (2013.01) [G01L 19/0084 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A pressure sensor, comprising:
a sensor body;
a pressure sensor element arranged on one surface side of the sensor body;
a through hole which is formed from the one surface side toward the other surface side of the sensor body, and through which a lead wire electrically connected to the pressure sensor element passes; and
an insulation layer formed on an inner wall of the through hole,
wherein a conducting body core of the lead wire comprises an insulated conducting body core part covered by an insulation coating and a bare conducting body core part not covered by the insulation coating, and the bare conducting body core part is a part of the lead wire that passes through the through hole and is electrically connected to the pressure sensor element via an electrode made of a brazing material,
wherein the electrode enters the inside of the through hole to form an intrusion part that covers on a portion of the insulation layer adjacent to the one surface side, and the bare conducting body core part is in contactly joined with the intrusion part inside the through hole.