US 12,422,307 B2
MEMS thermal sensor array
Matthew A. Hertel, Washington, DC (US)
Filed by Matthew A. Hertel, Washington, DC (US)
Filed on Oct. 22, 2022, as Appl. No. 17/971,585.
Claims priority of provisional application 63/270,983, filed on Oct. 22, 2021.
Prior Publication US 2023/0125783 A1, Apr. 27, 2023
Int. Cl. G01K 5/56 (2006.01)
CPC G01K 5/56 (2013.01) 13 Claims
OG exemplary drawing
 
1. A temperature sensor, comprising:
a nonconducting substrate having a surface aligned with a plane of the substrate and exhibiting an anisotropic coefficient of thermal expansion (CTE) in the plane;
electrical traces bonded to the surface of the nonconducting substrate, the electrical traces comprising four meander-lines forming a Wheatstone bridge circuit; and
a graphite spherical pebble where the nonconducting substrate is disposed on a surface of the graphite spherical pebble.