US 12,422,304 B2
Infrared sensor
Nobuaki Shimamoto, Fukui (JP); and Nayuta Minami, Fukui (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 18/019,994
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
PCT Filed Apr. 12, 2021, PCT No. PCT/JP2021/015139
§ 371(c)(1), (2) Date Feb. 6, 2023,
PCT Pub. No. WO2022/038828, PCT Pub. Date Feb. 24, 2022.
Claims priority of application No. 2020-138926 (JP), filed on Aug. 19, 2020.
Prior Publication US 2023/0288261 A1, Sep. 14, 2023
Int. Cl. G01J 5/16 (2006.01); G01J 5/08 (2022.01)
CPC G01J 5/16 (2013.01) [G01J 5/0853 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An infrared sensor comprising:
a package body;
an infrared sensor chip mounted on a front surface of the package body;
an outside cap which is electrically conductive and which has a function of transmitting infrared light which is a detection target to be detected by the infrared sensor chip, the outside cap being attached to the package body such that the outside cap is in front of, and covers, the infrared sensor chip; and
an inside cap which is electrically conductive and which has a function of transmitting the infrared light which is the detection target to be detected by the infrared sensor chip, the inside cap being disposed between the package body and the outside cap such that the inside cap is in front of, and covers, the infrared sensor chip,
the package body including a ground terminal to be connected to external ground,
the outside cap being electrically insulated from the inside cap and the infrared sensor chip,
the inside cap being electrically connected to the ground terminal.