US 12,422,162 B2
Cooling method and apparatus using internal circulation air flow
Dong Je Jeon, Cheonan-si (KR); and Kwang Hwa Lee, Suwon-si (KR)
Assigned to YC Corporation, Gyeonggi-Do (KR)
Filed by YC Corporation, Seongnam-si (KR)
Filed on Jun. 8, 2023, as Appl. No. 18/331,382.
Claims priority of application No. 10-2022-0088838 (KR), filed on Jul. 19, 2022.
Prior Publication US 2024/0027092 A1, Jan. 25, 2024
Int. Cl. F24F 11/79 (2018.01); F24F 13/10 (2006.01); F24F 110/10 (2018.01)
CPC F24F 11/79 (2018.01) [F24F 13/10 (2013.01); F24F 2110/10 (2018.01)] 14 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a first substrate including first cooling means using a refrigerant that is circulated with an outside;
a second substrate disposed to be in parallel with, and apart from, the first substrate and thus to form first heat accumulation space between the first and second substrates, the second substrate including second cooling means using a refrigerant that is circulated with the outside;
a first fan generating a first air flow in the first heat accumulation space in a direction parallel to the first and second substrates;
a housing of a closed structure;
a temperature sensor measuring the temperature in the apparatus at intervals of a predetermined amount of time; and
a first air flow controller automatically controlling an angle of the first fan in response to the temperature measured by the temperature sensor being outside of a predefined valid temperature range,
wherein the first air flow controller includes
a first fan tilt control motor configured to provide power for primarily controlling the angle of the first fan, and
a first air flap disposed between the first fan and the first heat accumulation space, the first air flap configured to secondarily control the first air flow generated by the first fan.