US 12,422,129 B1
Backlight module and assembly method thereof
Yin-Ting Lee, Hsinchu (TW); Hui-Chuan Chen, Hsinchu (TW); Bo-Yuan Su, Hsinchu (TW); and Pei-Chia Wu, Hsinchu (TW)
Assigned to AUO CORPORATION, Hsinchu (TW)
Filed by AUO Corporation, Hsinchu (TW)
Filed on Dec. 10, 2024, as Appl. No. 18/975,298.
Int. Cl. G02F 1/13357 (2006.01); F21V 19/00 (2006.01)
CPC F21V 19/0025 (2013.01) [G02F 1/133603 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A backlight module, comprising:
a back plate, comprising a positioning portion;
a plurality of conductive colloids, disposed on a surface of the back plate; and
a lighting board, comprising:
a substrate, comprising a first side and a second side opposite to each other and a first surface and a second surface opposite to each other, wherein the first surface of the substrate is divided into a light-emitting region and a peripheral region, the second surface of the substrate has a plurality of exposed copper regions overlapping with the light-emitting region, the light-emitting region is adjacent to the first side, the peripheral region is adjacent to the second side, the peripheral region has a slot, the slot penetrates through the first surface and the second surface and extends to the second side, the substrate is sleeved on and positioned to the positioning portion by the slot, the positioning portion is bendable from the back plate to abut against the peripheral region of the first surface of the substrate, the substrate faces toward the back plate and is adhered to the conductive colloids by the second surface of the substrate, the conductive colloids are adhered to the exposed copper regions on the second surface of the substrate, and positions of the conductive colloids correspond to the light-emitting region; and
a plurality of light-emitting components, disposed on the light-emitting region.