| CPC C23C 16/45553 (2013.01) [C23C 16/042 (2013.01); C23C 16/4408 (2013.01)] | 13 Claims |

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1. A method for areal selective forming of a thin film comprising:
a substrate preparation step of supplying and stabilizing a substrate including a growth area and a non-growth area into a chamber;
a precursor supply step of supplying a metal precursor compound into the chamber and adsorbing the metal precursor compound to the substrate;
a purge step of purging an inside of the chamber; and
a thin film formation step of supplying a reaction material into the chamber to react with the metal precursor compound and form a thin film,
wherein the metal precursor compound is a Group 5 metal precursor compound represented by Chemical Formula 1 below:
![]() wherein, in the Chemical Formula 1, M is any one selected from Group 5 metal elements of niobium (Nb), tantalum (Ta), and vanadium (V), R1, R2, and R3 are each independently selected from a linear alkyl group having 1 to 6 carbon atoms and a branched alkyl group having 3 to 6 carbon atoms, and X is each independently a halogen atom.
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