US 12,421,479 B2
Cleaning agent and method for manufacturing semiconductor device
Daisuke Koike, Tama Tokyo (JP); and Yuning Tsai, Yokohama Kanagawa (JP)
Assigned to Kabushiki Kaisha Toshiba, Tokyo (JP); and Toshiba Electronic Devices & Storage Corporation, Tokyo (JP)
Filed by Kabushiki Kaisha Toshiba, Tokyo (JP); and Toshiba Electronic Devices & Storage Corporation, Tokyo (JP)
Filed on Feb. 24, 2022, as Appl. No. 17/679,935.
Claims priority of application No. 2021-151355 (JP), filed on Sep. 16, 2021.
Prior Publication US 2023/0095013 A1, Mar. 30, 2023
Int. Cl. C11D 3/28 (2006.01); C11D 1/00 (2006.01); C11D 3/20 (2006.01); C11D 3/43 (2006.01); C11D 7/32 (2006.01); C11D 7/50 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01)
CPC C11D 7/3281 (2013.01) [C11D 1/00 (2013.01); C11D 3/43 (2013.01); C11D 7/5013 (2013.01); H01L 21/4825 (2013.01); H01L 21/4835 (2013.01); H01L 21/565 (2013.01); C11D 2111/22 (2024.01)] 12 Claims
OG exemplary drawing
 
1. A cleaning agent comprising from 1 wt % to 10 wt % of an azole-based compound comprising a glycidyl group, wherein the glycidyl group is directly attached to the azole-based compound.