	US 12,421,431 B2
	Structural adhesive compositions
Tien-Chieh Chao, Mars, PA (US); Masayuki Nakajima, Wexford, PA (US); Hongying Zhou, Allison Park, PA (US); Shanti Swarup, Allison Park, PA (US); and Umesh C. Desai, Wailuku, HI (US)
Assigned to PPG Industries Ohio, Inc., Cleveland, OH (US)
Filed by PPG Industries Ohio, Inc., Cleveland, OH (US)
Filed on Apr. 28, 2023, as Appl. No. 18/309,236.
Application 18/309,236 is a continuation of application No. 16/507,931, filed on Jul. 10, 2019, granted, now 11,674,062.
Application 16/507,931 is a continuation of application No. 14/964,795, filed on Dec. 10, 2015, granted, now 10,377,928, issued on Aug. 13, 2019.
Prior Publication US 2023/0279277 A1, Sep. 7, 2023
Int. Cl. C09J 163/00 (2006.01); C08G 59/14 (2006.01); C08G 59/16 (2006.01); C08G 59/40 (2006.01); C08G 59/44 (2006.01)

CPC C09J 163/00 (2013.01) [C08G 59/1455 (2013.01); C08G 59/1477 (2013.01); C08G 59/4042 (2013.01); C08G 59/44 (2013.01)]

19 Claims

1. An adhesive composition comprising:

an epoxy compound;

a compound in an amount of two to eight percent by weight based on total weight of the adhesive composition and comprising an aminimide functional group;

a reaction product of reactants comprising an amidine and a carbonic acid, a salt of a carbonic acid, a carbonate, or combinations thereof; and

a secondary latent curing catalyst comprising an amine, an imidazole, and/or a urea;

wherein the compound reacts with the epoxy compound upon activation by an external energy source.