US 12,421,423 B2
Polishing method, machine device manufacturing method, and machine device
Ryuji Monden, Tokyo (JP); and Kunio Kondo, Tokyo (JP)
Assigned to MITSUBISHI CORPORATION, Tokyo (JP)
Appl. No. 17/757,384
Filed by SHOWA DENKO K.K., Tokyo (JP)
PCT Filed Apr. 27, 2020, PCT No. PCT/JP2020/017953
§ 371(c)(1), (2) Date Jun. 15, 2022,
PCT Pub. No. WO2021/124597, PCT Pub. Date Jun. 24, 2021.
Claims priority of application No. 2019-230213 (JP), filed on Dec. 20, 2019.
Prior Publication US 2023/0033337 A1, Feb. 2, 2023
Int. Cl. C09G 1/02 (2006.01); C09K 3/14 (2006.01)
CPC C09G 1/02 (2013.01) [C09K 3/1409 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A polishing method comprising polishing a sliding part of a machine device by producing fullerene-aggregated particles by making the sliding part slide while a polishing-agent composition containing fullerenes and a solvent of the fullerenes is applied to the sliding part,
wherein the solvent is mineral oil or chemically-synthesized oil, and
wherein a concentration of the fullerenes in the polishing-agent composition is adjusted such that, while the polishing is in progress, the fullerene-aggregated particles are produced when a surface roughness of the sliding part is greater than a target value and not produced when the surface roughness of the sliding part is less than or equal to the target value.