US 12,421,164 B2
Substrate for transferring microstructures and method for manufacturing the same
Shuhei Ueda, Joetsu (JP); Masaki Takeuchi, Joetsu (JP); Hiroyuki Yamazaki, Joetsu (JP); and Kento Tsukada, Joetsu (JP)
Assigned to SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Filed by Shin-Etsu Chemical Co., Ltd., Tokyo (JP)
Filed on May 6, 2021, as Appl. No. 17/313,184.
Claims priority of application No. 2020-085108 (JP), filed on May 14, 2020.
Prior Publication US 2021/0355025 A1, Nov. 18, 2021
Int. Cl. C03C 17/30 (2006.01); C03C 15/00 (2006.01); C09J 5/06 (2006.01); C09J 7/20 (2018.01); C09J 7/38 (2018.01); C09J 183/04 (2006.01); H10H 20/01 (2025.01)
CPC C03C 17/30 (2013.01) [C03C 15/00 (2013.01); C09J 5/06 (2013.01); C09J 7/20 (2018.01); C09J 7/38 (2018.01); C09J 183/04 (2013.01); H10H 20/01 (2025.01); H10H 20/018 (2025.01); C03C 2217/70 (2013.01); C03C 2217/90 (2013.01); C09J 2203/326 (2013.01); C09J 2400/143 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate for transferring microstructures, comprising:
a synthetic quartz glass substrate having a front surface and a back surface; and
a pressure-sensitive adhesive agent layer provided on the front surface of the synthetic quartz glass substrate,
wherein the substrate includes an engraved mark provided in the front surface such that the engraved mark does not go all the way through the substrate, wherein the engraved mark is covered by said pressure-sensitive agent layer by applying said pressure-sensitive adhesive agent layer to said substrate and said engraved mark after said engraved mark is formed and said substrate can be used to transfer microstructures with bonding said pressure-sensitive adhesive agent layer to said microstructures.