| CPC B60H 1/00392 (2013.01) [B60H 1/00278 (2013.01); B60H 1/00485 (2013.01); B60H 1/3229 (2013.01)] | 20 Claims |

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1. A thermal management integration module, comprising:
a multi-channel integration board having a plurality of cooling connection pipelines formed therein, the multi-channel integration board being configured as a carrier member for the thermal management integration module; and
at least two thermal management components mounted on the multi-channel integration board and connected to each other by the plurality of cooling connection pipelines,
wherein the at least two thermal management components comprise at least two of an expansion tank, a multi-port valve, a water pump, a heat exchanger, a condenser, a temperature sensor, a dryer, an electronic expansion valve, a two-port proportional valve, or an air conditioning pipeline, wherein:
when the at least two thermal management components comprise the water pump, at least two water pumps are provided, and the at least two water pumps are mounted on a same side of an end of the multi-channel integration board in a length direction and are arranged in a width direction of the multi-channel integration board; and
when the at least two thermal management components further comprise the expansion tank, the expansion tank is mounted at a position on a side of the multi-channel integration board opposite to the water pump.
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