US 12,420,543 B2
Transfer printing stamps and methods of stamp delamination
Ken G. Purchase, Morrisville, NC (US); and Ronald S. Cok, Rochester, NY (US)
Assigned to X-Celeprint Limited, Dublin (IE)
Filed by X-Celeprint Limited, Dublin (IE)
Filed on Aug. 12, 2022, as Appl. No. 17/886,985.
Claims priority of provisional application 63/233,946, filed on Aug. 17, 2021.
Prior Publication US 2023/0059174 A1, Feb. 23, 2023
Int. Cl. B41F 16/00 (2006.01); B41K 3/02 (2006.01); H01L 23/00 (2006.01)
CPC B41F 16/0053 (2013.01) [B41F 16/0073 (2013.01); B41K 3/02 (2013.01); H01L 24/97 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A system for micro-transfer printing, the system comprising:
a motion-control platform;
a stamp comprising
a support having a support surface, and
posts disposed on the support surface, each of the posts comprising a distal end extending away from the support, the post having a post surface on the distal end, wherein the post surface is a structured surface comprising spatially separated ridges that extend in a ridge direction entirely across the post surface; and
components on a component source wafer, each of the components disposed on the source wafer to contact one of the posts such that the spatially separated ridges of the post surface are in contact with the component,
wherein the motion-control platform is operable to move the stamp to adhere the ridges of the posts to the components and to move the stamp horizontally in a direction at least partially orthogonal to the ridge direction, thereby delaminating the ridges from the components during printing of the components to a target substrate.