US 12,420,455 B2
Mold device
Hirotsune Watanabe, Toyota (JP); So Nakayama, Toyota (JP); Akinobu Kawai, Toyota (JP); and Hiroyuki Hamaguchi, Toyota (JP)
Assigned to TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP)
Filed by TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP)
Filed on Jan. 24, 2023, as Appl. No. 18/158,819.
Claims priority of application No. 2022-029489 (JP), filed on Feb. 28, 2022.
Prior Publication US 2023/0271351 A1, Aug. 31, 2023
Int. Cl. B29C 33/30 (2006.01); B29C 33/24 (2006.01); B29C 45/17 (2006.01)
CPC B29C 33/307 (2013.01) [B29C 33/24 (2013.01); B29C 45/1742 (2013.01); B29C 45/1761 (2013.01); B29C 2045/1763 (2013.01); B29C 2045/1788 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A mold device comprising:
a frame that is a vertical wall having a first surface that is a vertical surface of the frame;
a holding means mounted to, and supported only by, the first surface of the frame;
a fixed mold base for supporting a fixed mold, one surface of the fixed mold base being fixed to the first surface of the frame; and
a mobile mold base for supporting a mobile mold, the mobile mold base being held by the holding means so that the mobile mold base moves closer to and away from the fixed mold base;
wherein
the holding means comprises a rail fixed to the first surface of the frame, and a guide fit on the rail in such a way that the guide moves on the rail while the guide is fixed to the mobile mold base,
the mobile mold base is supported by the holding means without using a tie bar, and
the mobile mold base is cantilevered on the first surface of the frame via the holding means.