US 12,420,378 B2
Substrate processing apparatus and method for controlling dressing of polishing member
Yasumasa Hiroo, Tokyo (JP); and Keita Yagi, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Aug. 10, 2021, as Appl. No. 17/398,684.
Claims priority of application No. 2020-135750 (JP), filed on Aug. 11, 2020.
Prior Publication US 2022/0048160 A1, Feb. 17, 2022
Int. Cl. B24B 53/017 (2012.01)
CPC B24B 53/017 (2013.01) 8 Claims
OG exemplary drawing
 
1. A substrate processing apparatus that polishes a substrate by sliding the substrate on a polishing member, the substrate processing apparatus comprising:
a dresser that dresses the polishing member by swinging on the polishing member, the dresser being enabled to adjust a swing speed in a plurality of scanning areas set on the polishing member along a radial direction;
a height detection section configured to generate a pad profile by measuring values of a surface height of the polishing member along the radial direction of the polishing member;
a dresser load setting section configured to set a dresser load to be applied by the dresser to the polishing member;
a pad height correction section configured to correct the pad profile by calculating a plurality of amounts of correction of the surface height of the polishing member according to an amount of variation from a reference load of the dresser load at a plurality of positions over the radial direction and correcting the measured values of the surface height with the plurality of amounts of correction at corresponding positions in the radial direction;
a moving speed calculation section configured to adjust the swing speed of the dresser in each of the plurality of scanning areas based on the corrected pad profile; and
a correction data storage section that stores a plurality of pieces of pad height reference data along the radial direction of the polishing member in association with a plurality of reference dresser loads,
wherein the pad height correction section is configured to calculate the amounts of correction of the surface height by interpolating the amounts of correction with the pad height reference data corresponding to the reference dresser load close to the set dresser load and the pad height reference data corresponding to the reference dresser load close to the reference load,
wherein the pad height reference data is provided for any of a plurality of types of the polishing member or for any of a plurality of types of a dressing surface of the dresser, and
wherein the pad height correction section is configured to calculate a pad height PadHx corresponding to a set dresser load DFx according to a formula:
PadHx=(PadH1−PadH2)/(DF1−DF2)×(DFx−DF2)+PadH2
wherein DF1 and DF2 are two dresser loads close to the DFx, and PadH1 and PadH2 are pad height reference data corresponding to the dresser loads DF1 and DF2.