US 12,420,374 B2
Chemical-mechanical polishing system with a potentiostat and pulsed-force applied to a workpiece
Vladimir Gulkov, San Jose, CA (US); and Nikolay Yeremin, San Jose, CA (US)
Assigned to Bruker Nano, Inc., San Jose, CA (US)
Filed by Bruker Nano Inc., San Jose, CA (US)
Filed on May 1, 2024, as Appl. No. 18/652,248.
Application 18/652,248 is a continuation of application No. 17/850,228, filed on Jun. 27, 2022, granted, now 12,011,800.
Application 17/850,228 is a continuation of application No. 17/197,386, filed on Mar. 10, 2021, granted, now 11,389,923, issued on Jul. 19, 2022.
Claims priority of provisional application 62/988,602, filed on Mar. 12, 2020.
Prior Publication US 2024/0286242 A1, Aug. 29, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. B24B 37/013 (2012.01); B24B 37/04 (2012.01); B24B 37/10 (2012.01); B24B 37/30 (2012.01); B24B 49/00 (2012.01); B24B 49/10 (2006.01)
CPC B24B 37/013 (2013.01) [B24B 37/042 (2013.01); B24B 37/046 (2013.01); B24B 37/107 (2013.01); B24B 37/30 (2013.01); B24B 49/006 (2013.01); B24B 49/10 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A chemical-mechanical-polishing apparatus for polishing a workpiece, the apparatus comprising:
a table that is operably connected with a motor and a motor drive of the apparatus;
a reservoir formed above the table and removably carried by the table;
a carrier chuck having a chuck head containing a piezoelectric element disposed therein;
a microcontroller configured to at least govern an operation of the motor drive and modify one or more of parameters of the polishing based on measurement data representing said polishing and collected by a measurement system of the apparatus; and
the measurement system of the apparatus that includes an electrode holder.