US 12,420,348 B2
Solder reflow apparatus and method of manufacturing electronic device
Youngja Kim, Suwon-si (KR); and Sunwon Kang, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jun. 20, 2024, as Appl. No. 18/748,513.
Claims priority of application No. 10-2023-0095911 (KR), filed on Jul. 24, 2023.
Prior Publication US 2025/0033132 A1, Jan. 30, 2025
Int. Cl. B23K 3/00 (2006.01); B23K 1/00 (2006.01); B23K 3/04 (2006.01); B23K 3/08 (2006.01); B23K 101/40 (2006.01); H01L 23/00 (2006.01)
CPC B23K 3/085 (2013.01) [B23K 1/0016 (2013.01); B23K 3/04 (2013.01); B23K 2101/40 (2018.08); H01L 24/13 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/75 (2013.01); H01L 2224/81815 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A solder reflow apparatus, comprising:
a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated when the heat transfer fluid is heated;
a heater configured to heat the heat transfer fluid within the vapor generating chamber;
a substrate stage configured to move up and down within the vapor generating chamber and configured to support a substrate on which an electronic component is mounted via solders; and
a cleaning portion disposed in a cooling region of the vapor generating chamber,
wherein the cleaning portion includes a fluid shielding cover that is configured to cover the substrate on the substrate stage when the substrate stage is in the cooling region to form a cleaning space, and a spray nozzle configured to spray a cleaning fluid onto the substrate in the cleaning space.