US 12,420,307 B2
Substrate processing method and substrate processing system
Takahito Nakashoya, Hillsboro, OR (US); and Takayuki Matsukawa, Hillsboro, OR (US)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Nov. 21, 2023, as Appl. No. 18/515,426.
Claims priority of application No. 2022-188197 (JP), filed on Nov. 25, 2022.
Prior Publication US 2024/0173742 A1, May 30, 2024
Int. Cl. B05D 3/02 (2006.01); B05D 1/02 (2006.01)
CPC B05D 3/0218 (2013.01) [B05D 1/02 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate processing method, comprising:
processing a first surface of a substrate by a chemical liquid supplied to the first surface from a chemical liquid supply; and
heating the substrate by starting a supply of a heated fluid to a second surface of the substrate prior to a start of a supply of the chemical liquid to the first surface of the substrate,
wherein a temperature of at least one of the chemical liquid to be supplied to the first surface or the heated fluid to be supplied to the second surface is adjusted based on a chemical liquid discharge standby time during which a discharge of the chemical liquid from the chemical liquid supply is not performed continuously.