US 12,096,569 B2
Manufacturing method of insulated metal substrate
Chun-Ta Yeh, Taoyuan (TW); Kuo-Pin Cheng, Taoyuan (TW); and Chin-Long Lin, Taoyuan (TW)
Assigned to Jentech Precision Industrial Co., LTD., Taoyuan (TW)
Filed by Jentech Precision Industrial Co., LTD., Taoyuan (TW)
Filed on Oct. 23, 2020, as Appl. No. 17/078,108.
Application 17/078,108 is a division of application No. 16/711,450, filed on Dec. 12, 2019, granted, now 11,083,087.
Claims priority of application No. 108101055 (TW), filed on Jan. 10, 2019.
Prior Publication US 2021/0045240 A1, Feb. 11, 2021
Int. Cl. H05K 3/44 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H05K 1/05 (2006.01); H05K 3/10 (2006.01); H05K 3/20 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01)
CPC H05K 3/44 (2013.01) [H01L 21/4882 (2013.01); H01L 23/3672 (2013.01); H05K 1/056 (2013.01); H05K 3/10 (2013.01); H05K 3/202 (2013.01); H05K 3/4608 (2013.01); H05K 1/0204 (2013.01); H05K 1/0209 (2013.01); H05K 1/05 (2013.01); H05K 2203/13 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method of manufacturing an insulated metal substrate, comprising:
receiving a plastic frame, wherein the plastic frame has a plurality of aperture areas;
forming a plurality of conductive metal pads comprising copper, wherein the shapes of the conductive metal pads respectively correspond to the shapes of the aperture areas, the sizes of the conductive metal pads are respectively the same as the sizes of the aperture areas, and a thickness of each one of the conductive metal pads is in a range from 1 mm to 5 mm;
respectively positioning the conductive metal pads into the aperture areas of the plastic frame by pressing the conductive metal pads into place, such that sidewalls of the conductive metal pads are tightly surrounded by the plastic frame; and
disposing the plastic frame and the conductive metal pads on an insulating layer of a metal substrate.