US 12,096,525 B2
Lens heating systems and methods for an LED lighting system
Eric Deering, Hartland, WI (US); Peter Andrew Zagar, Hartford, WI (US); Bradley William Kay, Mequon, WI (US); and Dragoslav Popovic, Germantown, WI (US)
Assigned to J.W. SPEAKER CORPORATION, Germantown, WI (US)
Filed by J.W. SPEAKER CORPORATION, Germantown, WI (US)
Filed on May 24, 2021, as Appl. No. 17/328,310.
Application 17/328,310 is a division of application No. 16/441,514, filed on Jun. 14, 2019, granted, now 11,019,689.
Application 16/441,514 is a continuation in part of application No. 15/182,994, filed on Jun. 15, 2016, granted, now 10,364,954.
Claims priority of provisional application 62/175,542, filed on Jun. 15, 2015.
Prior Publication US 2021/0282234 A1, Sep. 9, 2021
Int. Cl. H05B 3/84 (2006.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); B29C 45/16 (2006.01); B29D 11/00 (2006.01); B29L 31/34 (2006.01); F21S 45/60 (2018.01); F21V 29/90 (2015.01); H05K 1/02 (2006.01)
CPC H05B 3/84 (2013.01) [B29C 45/14 (2013.01); B29C 45/14008 (2013.01); F21S 45/60 (2018.01); F21V 29/90 (2015.01); H05K 1/0274 (2013.01); B29C 45/00 (2013.01); B29C 45/1642 (2013.01); B29D 11/00 (2013.01); B29D 11/00413 (2013.01); B29L 2031/3425 (2013.01); B29L 2031/3493 (2013.01); H05B 2203/017 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for manufacturing a heated lens system, the method comprising:
applying a conductive ink or film circuit on a substantially clear thermoplastic substrate;
positioning the thermoplastic substrate in a cavity of an injection molding tool;
positioning an interconnect assembly in a pocket of a core of the injection molding tool, the interconnect assembly comprising a spring connector that is mounted to a printed circuit board;
positioning the interconnect assembly against the thermoplastic substrate to establish an electrical connection between the interconnect assembly and the thermoplastic substrate; and
injecting a resin into the injection molding tool,
wherein the interconnect assembly is configured to supply power to the conductive ink or film circuit via the electrical connection.