CPC H01Q 1/2283 (2013.01) [H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 25/16 (2013.01); H01Q 21/06 (2013.01)] | 13 Claims |
1. An electronic device, comprising:
a first package having a first side and a second side opposing the first side, the first package comprising a first electronic component and a second electronic component arranged in a side-by-side manner on the second side;
a molding compound encapsulating the first electronic component and the second electronic component;
a metal coating layer on the molding compound;
a metal inter-wall provided in the molding compound between the first electronic component and the second electronic component, wherein the metal inter-wall is in direct contact with the metal coating layer;
a second package mounted on the first side of the first package, wherein the second package comprises a radiative antenna element; and
a connector configured to electrically couple to a 5G modem through a flex cable and disposed on the second side.
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