US 12,094,915 B2
Micro-LED structure and micro-LED chip including same
Qiming Li, Albuquerque, NM (US); Yuankun Zhu, Shanghai (CN); Anle Fang, Shanghai (CN); Deshuai Liu, Shanghai (CN); and Jian Guo, Shanghai (CN)
Assigned to JADE BIRD DISPLAY (SHANGHAI) LIMITED, Shanghai (CN)
Filed by JADE BIRD DISPLAY (SHANGHAI) LIMITED, Shanghai (CN)
Filed on Dec. 27, 2021, as Appl. No. 17/562,439.
Claims priority of provisional application 63/131,128, filed on Dec. 28, 2020.
Prior Publication US 2022/0208846 A1, Jun. 30, 2022
Int. Cl. H01L 27/15 (2006.01); H01L 25/075 (2006.01); H01L 33/02 (2010.01); H01L 33/04 (2010.01); H01L 33/06 (2010.01); H01L 33/10 (2010.01); H01L 33/14 (2010.01); H01L 33/36 (2010.01); H01L 33/38 (2010.01); H01L 33/46 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01)
CPC H01L 27/153 (2013.01) [H01L 25/0753 (2013.01); H01L 27/15 (2013.01); H01L 33/02 (2013.01); H01L 33/04 (2013.01); H01L 33/06 (2013.01); H01L 33/10 (2013.01); H01L 33/38 (2013.01); H01L 33/46 (2013.01); H01L 33/50 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/36 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A micro-LED chip including multiple micro-LEDs, wherein,
at least one micro-LED of the multiple micro-LEDs comprises:
a first type conductive layer;
a second type conductive layer stacked on the first type conductive layer; and
a light emitting layer formed between the first type conductive layer and the second type conductive layer, wherein the light emitting layer extends along a horizontal level from a top edge of the first type conductive layer and a bottom edge of the second type conductive layer, such that an edge of the light emitting layer does not contact the top edge of the first type conductive layer and the bottom edge of the second type conductive layer, and a profile of the second type conductive layer perpendicularly projected on a top surface of the first type conductive layer is surrounded by an edge of the first type conductive layer, and
the micro-LED chip further includes a metal layer formed on a portion of the light emitting layer that extends from the top edge of the first type conductive layer.