US 12,094,828 B2
Eccentric via structures for stress reduction
Shu-Shen Yeh, Taoyuan (TW); Che-Chia Yang, Taipei (TW); Chia-Kuei Hsu, Hsinchu (TW); Po-Yao Lin, Zhudong Township (TW); Shin-Puu Jeng, Hsinchu (TW); and Chia-Hsiang Lin, Zhubei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Dec. 18, 2020, as Appl. No. 17/126,881.
Claims priority of provisional application 63/053,317, filed on Jul. 17, 2020.
Prior Publication US 2022/0020693 A1, Jan. 20, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/5384 (2013.01) [H01L 21/4853 (2013.01); H01L 21/486 (2013.01); H01L 21/76802 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/14 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
forming a first dielectric layer;
forming a first redistribution line comprising a first via extending into the first dielectric layer, and a first trace over the first dielectric layer;
forming a second dielectric layer covering the first redistribution line;
patterning the second dielectric layer to form a via opening, wherein the first redistribution line is revealed through the via opening;
depositing a metal seed layer, wherein a part of the metal seed layer extends into the via opening;
plating a conductive material into the via opening and on the metal seed layer to form a second via in the second dielectric layer, and a conductive pad over and contacting the second via;
forming a plating mask covering and contacting the metal seed layer and a top surface of a peripheral portion of the conductive pad, wherein an additional portion of the conductive pad is exposed through the plating mask;
plating a conductive bump over the conductive pad, wherein the conductive bump is plated using the metal seed layer, wherein the second via is offset from a center line of the conductive bump;
removing the plating mask;
bonding a package component over the conductive bump; and
dispensing an underfill, wherein the underfill contacts a first sidewall of the conductive bump, and the underfill further contacts the top surface and a second sidewall of the conductive pad.