US 12,094,819 B2
Method for forming package structure
Po-Hao Tsai, Zhongli (TW); Techi Wong, Zhubei (TW); Meng-Liang Lin, Hsinchu (TW); Yi-Wen Wu, New Taipei (TW); Po-Yao Chuang, Hsin-Chu (TW); and Shin-Puu Jeng, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Aug. 18, 2021, as Appl. No. 17/405,389.
Application 17/405,389 is a division of application No. 16/380,502, filed on Apr. 10, 2019, granted, now 11,101,214.
Claims priority of provisional application 62/787,490, filed on Jan. 2, 2019.
Prior Publication US 2021/0384125 A1, Dec. 9, 2021
Int. Cl. H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/07 (2006.01)
CPC H01L 23/5283 (2013.01) [H01L 23/3128 (2013.01); H01L 23/3185 (2013.01); H01L 23/49575 (2013.01); H01L 23/49861 (2013.01); H01L 23/5389 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 25/0657 (2013.01); H01L 25/074 (2013.01); H01L 25/50 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/3207 (2013.01); H01L 2224/32225 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/0652 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for forming a package structure, comprising:
forming a first interconnect structure over a carrier substrate;
disposing a first die structure over the first interconnect structure;
forming a dam structure over the first die structure, wherein the dam structure has a line shape in a top-view;
forming a protection layer over a second interconnect structure;
bonding the second interconnect structure over the dam structure;
filling a package material to form a package layer between the first interconnect structure and the second interconnect structure, wherein a flow direction of the package material is parallel to a lengthwise direction of the line shape of the dam structure; and
removing the protection layer.