US 12,094,733 B2
Substrate treatment apparatus
Young Dae Chung, Incheon (KR); Won Geun Kim, Goyang-si (KR); Jee Young Lee, Incheon (KR); Ji Hoon Jeong, Hwaseong-si (KR); Tae Shin Kim, Suwon-si (KR); Se Hoon Oh, Cheonan-si (KR); Pil Kyun Heo, Hwaseong-si (KR); and Hyun Goo Park, Cheonan-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Oct. 17, 2020, as Appl. No. 17/073,342.
Claims priority of application No. 10-2019-0130517 (KR), filed on Oct. 21, 2019.
Prior Publication US 2021/0118701 A1, Apr. 22, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); H01L 21/306 (2006.01); C09K 13/04 (2006.01)
CPC H01L 21/6708 (2013.01) [H01L 21/30604 (2013.01); H01L 21/67115 (2013.01); C09K 13/04 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate treatment apparatus comprising:
a rotation unit configured to rotate a substrate;
a chemical discharge unit configured to discharge a chemical solution to a front surface of the substrate on the rotation unit;
a chemical recovery unit disposed close to the rotation unit and configured to collect a portion of the chemical solution scattered by the rotation unit; and
a laser irradiation unit disposed under the rotation unit and configured to emit a laser beam to a rear surface of the substrate and heat the substrate,
wherein the rotation unit includes:
a supporting member made of a transparent material so that the laser beam emitted by the laser irradiation unit is transmitted through the supporting member to the rear surface of the substrate, the rear surface directly contacting the supporting member; and
a rotation member engaged with the supporting member and configured to support an edge of the supporting member.