US 12,094,655 B2
Electronic component and method of manufacturing the same
Won Hee Yoo, Suwon-si (KR); Sang Moon Lee, Suwon-si (KR); Eun Kwang Lee, Suwon-si (KR); Jae Young Na, Suwon-si (KR); and Han Seong Jung, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Sep. 8, 2021, as Appl. No. 17/469,125.
Claims priority of application No. 10-2020-0152643 (KR), filed on Nov. 16, 2020.
Prior Publication US 2022/0157526 A1, May 19, 2022
Int. Cl. H01G 4/008 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/0085 (2013.01) [H01G 4/30 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
a plurality of dielectric layers; and
a plurality of first internal electrodes and a plurality of second internal electrodes alternately disposed with a corresponding dielectric layer interposed therebetween,
wherein one of the plurality of first internal electrodes includes a metal layer containing Ni and Sn, a first graphene layer disposed on a lower surface of the metal layer, and a second graphene layer disposed on an upper surface of the metal layer,
wherein the metal layer includes a core region, a first edge region arranged between the first graphene layer and the core region, and a second edge region arranged between the second graphene layer and the core region,
wherein each of the first and second edge regions has a higher Sn content than the core region, and
wherein the first and second edge regions directly contact the first and second graphene layers, respectively.