US 12,094,496 B1
Dual circuit isolation of writer to reader crosstalk for SGV modules
David J. Seagle, Morgan Hill, CA (US); and Robert G. Biskeborn, Hollister, CA (US)
Assigned to Western Digital Technologies, Inc., San Jose, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on Jul. 28, 2023, as Appl. No. 18/227,510.
Claims priority of provisional application 63/452,533, filed on Mar. 16, 2023.
This patent is subject to a terminal disclaimer.
Int. Cl. G11B 5/11 (2006.01); G11B 5/02 (2006.01); G11B 5/39 (2006.01); G11B 5/73 (2006.01)
CPC G11B 5/11 (2013.01) [G11B 5/02 (2013.01); G11B 5/3967 (2013.01); G11B 5/739 (2019.05)] 27 Claims
OG exemplary drawing
 
1. A same gap verify (SGV) module head assembly, comprising:
a closure;
a substrate disposed adjacent to the closure;
a plurality of write transducer and read transducer pairs disposed between the closure and the substrate at a media facing surface;
a plurality of write bonding pads disposed adjacent to the closure;
a plurality of write leads, wherein one or more write bonding pads of the plurality of write bonding pads are coupled to each write transducer via one or more write leads of the plurality of write leads;
a plurality of read bonding pads disposed adjacent to the plurality of write bonding pads;
a plurality of read leads, wherein one or more read bonding pads of the plurality of read bonding pads are coupled to each read transducer via one or more read leads of the plurality of read leads;
an isolation shield recessed from the media facing surface, the isolation shield being disposed between the write transducer and the read transducer of each pair such that the isolation shield is disposed between the plurality of write leads and the plurality of read leads; and
at least one ground bonding pad, wherein the isolation shield is coupled to the at least one ground bonding pad, the closure, and the substrate.