US 12,093,923 B2
Microprocessor as a security layer
Stefano Bianconi, Berlin (DE)
Assigned to SumUp Payments Ltd., London (GB)
Appl. No. 18/000,235
Filed by SumUp Payments Ltd., London (GB)
PCT Filed Sep. 24, 2021, PCT No. PCT/US2021/051846
§ 371(c)(1), (2) Date Feb. 28, 2023,
PCT Pub. No. WO2022/066977, PCT Pub. Date Mar. 31, 2022.
Claims priority of provisional application 63/082,749, filed on Sep. 24, 2020.
Prior Publication US 2023/0229871 A1, Jul. 20, 2023
Int. Cl. G06Q 20/34 (2012.01); G06K 7/00 (2006.01); G06K 7/10 (2006.01); G06Q 20/20 (2012.01); G07F 7/08 (2006.01); G09G 3/36 (2006.01)
CPC G06Q 20/34 (2013.01) [G06K 7/006 (2013.01); G06K 7/0091 (2013.01); G06K 7/10297 (2013.01); G06Q 20/20 (2013.01); G07F 7/0886 (2013.01); G09G 3/36 (2013.01); G09G 2310/02 (2013.01); G09G 2340/0435 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A device comprising:
a case;
a printed circuit board (PCB) coupled to the case, the PCB with a first side and a second side, the first and second sides parallel and opposite to one another, wherein at least one via extends through the PCB from the first side to the second side;
a microprocessor coupled to the first side of the PCB and electrically coupled to the via, the microprocessor having a footprint defined by a boundary line drawn around the perimeter of the microprocessor, the boundary line perpendicular to the plane of the microprocessor and through the PCB, the microprocessor having at least one input/output (I/O) pin within the microprocessor footprint and between the top of the microprocessor and the first side of the PCB;
a first mesh coupled to the PCB and including a plurality of electrical traces as part of an electrical circuit, the plurality of electrical traces of the first mesh having a spacing between two immediately adjacent traces of no more than 150 micrometers throughout the first mesh, the first mesh existing on a plane parallel to the first and second sides;
at least one electrode coupled to the second side of the PCB and electrically coupled to the I/O pin through the via, the electrode within the microprocessor footprint; and
a cover coupled to the second side of the PCB, the cover further including a second mesh coupled to the cover, the second mesh including a plurality of electrical traces as part of an electrical circuit, the plurality of electrical traces of the second mesh having a spacing between two immediately adjacent traces of no more than 150 micrometers throughout the second mesh, the second mesh existing on a plane parallel to the cover.