US 12,093,630 B2
Method and computing device for manufacturing semiconductor device
Sooyong Lee, Yongin-si (KR); Jeeyong Lee, Anyang-si (KR); and Jaeho Jeong, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jul. 27, 2023, as Appl. No. 18/360,209.
Application 18/360,209 is a division of application No. 17/112,048, filed on Dec. 4, 2020, granted, now 11,763,058.
Claims priority of application No. 10-2020-0051761 (KR), filed on Apr. 28, 2020.
Prior Publication US 2024/0020450 A1, Jan. 18, 2024
Int. Cl. G06F 30/392 (2020.01); G03F 7/00 (2006.01); G06N 5/04 (2023.01); G06N 20/00 (2019.01); G06F 119/18 (2020.01)
CPC G06F 30/392 (2020.01) [G03F 7/70441 (2013.01); G06N 5/04 (2013.01); G06N 20/00 (2019.01); G06F 2119/18 (2020.01)] 9 Claims
OG exemplary drawing
 
1. A method for manufacturing of a semiconductor device comprising:
receiving an image of a first layout including patterns for the manufacturing of the semiconductor device;
dividing the image of the first layout to generate grids;
extracting features of the grids; and
performing a machine learning-based inference on the features to generate an image associated with an after cleaning inspection (ACI),
wherein the extracting the features of the grids include extracting an influence exerted by the grids on neighboring grids.